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    Through the introduction of Japan’s advanced DISCO machines, ECT can offer single-cut or double-cut die saw services for 4”, 5”, 6”, 8”, and 12” wafers, including silicon wafer, glass, sensor, and LCD driver ICs

Wafer Size: 12” or below
Wafer Thickness: 800mm or below
Grain Size: Minimum up to 02mm*02mm

Main machine equipment models:

 

12 inch: Disco DFD-6361/DFD-6362

 

8-inch: Disco DFD-651/DFD-6340


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