Home About ECT Main Items Process Job Contact Us
Main Items
    Main Items :>>Die Saw

    Through the introduction of Japan’s advanced DISCO machines, ECT can offer single-cut or double-cut die saw services for 4”, 5”, 6”, 8”, and 12” wafers, including silicon wafer, glass, sensor, and LCD driver ICs

Wafer Size: 12” or below
Wafer Thickness: 800mm or below
Grain Size: Minimum up to 02mm*02mm

Main machine equipment models:


12 inch: Disco DFD-6361/DFD-6362


8-inch: Disco DFD-651/DFD-6340

CopyRight @ 2000-2023 E-Creative Technology Limited