Through the introduction of Japan’s advanced DISCO machines, ECT can offer single-cut or double-cut die saw services for 4”, 5”, 6”, 8”, and 12” wafers, including silicon wafer, glass, sensor, and LCD driver ICs
Capacity: 21,000 pcs per month
Wafer Size: 12” or below
Wafer Thickness: 800mm or below
Grain Size: Minimum up to 02mm*02mm
The main equipment model:
Disco DFD 6361 (1 set) for 12” wafer
Disco DFD 651 (6 sets) for 8” wafer
DFD 6340 (5 sets)
Accretech WD—200T (1 set)
Disco DAD 321 (2 sets) for 6” wafer |