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    Main Items :>>Back Grinding

    ECT provides wafer grinding and wafer polishing services, including gold bump, solder bump wafers
Back Grinding:
Accuracy: 3um or below
Minimal Thickness: 100um
Monthly capacity: 15000pcs
The main equipment model:
Grinding machine: DFG 850

3P bending test B10 greater than 450Mpa
Polisher: DFP 8140

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